Description
(BUKU 2018) (BA) 978-0071502665 3D IC Integration and Packaging fully explains the latest Fabless Semiconductor Implementation takes you step-by- step through the challenges faced by fabless firms in the development of integrated circuits. This expert guide examines the potential pitfalls of IC implementation in the rapidly growing fabless segment of the semiconductor industry and elaborates how to overcome these difficul- ties. It provides a comprehensive overview of the issues that executives and technical professionals encounter at fabless companies. Filled with over 150 on-target illus- trations, this business-building tool presents a clear picture of the entire lifecycle of a fabless enterprise, describing how to envision and execute fabless IC implementation. Inside This Comprehensive Guide to Fabless IC Design 1.Define and specify the product 2.Understand the customer requirements, the value chain, and the supply chain 3.Select the right implementation approach, including, make vs. buy 4Pengarang :
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